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NEXT-GENERATION

OPTICAL METROLOGY ENABLES

NEXT-GEN MANUFACTURING

LAYER METRICS iDaR™
in-Process Detect and Report

Real-time detect and report enables high-yield

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Data captured and processed during manufacturing enables increased productivity

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Multiplexed synchronized sensing enabled by multiplexed metrology in a single instrument

SOLUTION TO PROBLEM

Currently, yield loss must approach zero to enable profitable business models when making very-high-value components.

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Layer Metrics is enabling the transition to high-value, high-yield advanced manufacturing with its advanced

in-process metrology, sensing and inspection.

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  • New Device Architecture

  • Synchronized Multiplexed Metrology (FDM + WDM + TDM + SDM)

  • Single, multi-parameter instrument delivering continuous monitoring with both sub-micron resolutionand large field of view

CAPABILITIES

In-Process Monitor

Multiplexed Metrology

Chip & Package Layout

Temperature Dependence

Opaque Materials

Buried Structure between Wafers or beneath    Metals and Dielectrics
Pattern Geometry
Material ID
Warp, Bow, TTV

Optical Thickness
Refractive Index
Geometric Thickness
Wavelength
Delay & Dispersion

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ADDITIVE TYPES 

POWDER BED FUSION (PBF)

DIRECTED ENERGY DEPOSITION (DED)

ADDITIVE MANUFACTURING ELECTRONICS

LIQUID METAL JETTING (LMJ)

MATERIAL JETTING

BINDER JETTING

COLD SPRAY

SHEET LAMINATION

VAT PHOTOPOLYMERIZATION

MATERIAL EXTRUSION

CAPABILITIES

Metal Droplet In-flight Profile

Metal Droplet Thermal Profile

Dielectric / Insulator Layer Profile

Conductive Line Deformations

Conductive Line Continuity

Curing Source Wavelength

Curing Source Power

Curing Source Profile

Leading and Trailing Edge Powder Profile

Leading and Trailing Edge Binder Profile

Laser Wavelength

Laser Power

Laser Profile

Single and Multiple Lasers

Powder-Bed Profile

Powder-Feed

Melt-Pool Profile

Surface Layer Profile

Bonding Layer Profile

Wire-Feed

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