NEXT-GENERATION
OPTICAL METROLOGY ENABLES
NEXT-GEN MANUFACTURING
LAYER METRICS iDaR™
in-Process Detect and Report
Real-time detect and report enables high-yield
Data captured and processed during manufacturing enables increased productivity
Multiplexed synchronized sensing enabled by multiplexed metrology in a single instrument
SOLUTION TO PROBLEM
Currently, yield loss must approach zero to enable profitable business models when making very-high-value components.
Layer Metrics is enabling the transition to high-value, high-yield advanced manufacturing with its advanced
in-process metrology, sensing and inspection.
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New Device Architecture
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Synchronized Multiplexed Metrology (FDM + WDM + TDM + SDM)
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Single, multi-parameter instrument delivering continuous monitoring with both sub-micron resolutionand large field of view
CAPABILITIES
In-Process Monitor
Multiplexed Metrology
Chip & Package Layout
Temperature Dependence
Opaque Materials
Buried Structure between Wafers or beneath Metals and Dielectrics
Pattern Geometry
Material ID
Warp, Bow, TTV
Optical Thickness
Refractive Index
Geometric Thickness
Wavelength
Delay & Dispersion
ADDITIVE TYPES
POWDER BED FUSION (PBF)
DIRECTED ENERGY DEPOSITION (DED)
ADDITIVE MANUFACTURING ELECTRONICS
LIQUID METAL JETTING (LMJ)
MATERIAL JETTING
BINDER JETTING
COLD SPRAY
SHEET LAMINATION
VAT PHOTOPOLYMERIZATION
MATERIAL EXTRUSION
CAPABILITIES
Metal Droplet In-flight Profile
Metal Droplet Thermal Profile
Dielectric / Insulator Layer Profile
Conductive Line Deformations
Conductive Line Continuity
Curing Source Wavelength
Curing Source Power
Curing Source Profile
Leading and Trailing Edge Powder Profile
Leading and Trailing Edge Binder Profile
Laser Wavelength
Laser Power
Laser Profile
Single and Multiple Lasers
Powder-Bed Profile
Powder-Feed
Melt-Pool Profile
Surface Layer Profile
Bonding Layer Profile
Wire-Feed
